As the rate of technical innovation continues to increase, so will the need for practical insights and solutions. Immerse yourself in the expertly curated DesignCon conference curriculum, created by engineers for engineers. With 100+ sessions spanning 14 tracks, DesignCon 2021's conference program covers all aspects of electronic design, including signal & power integrity, high-speed link design, and machine learning.

From foundational to applicational, topics and areas of coverage include:

• Signal and power integrity
• Chip I/O and power modeling
• Photonics and wireless in electrical design
• Materials and processing for PCBs, modules, and packages
• Advanced I/O interface design
• High-speed link design
• Signal processing, equalization, and coding/FEC
• Power integrity in power distribution networks
• Electromagnetic compatibility and interference
• Test and measurement methodology
• Interconnects modeling and analysis
• Machine learning and AI
• 5G and communications