Cadence Webcast - On Demand

Title: A Power Integrity Engineer’s Guide to Up-Leveled Signoff Methodology

Sponsored by: Cadence

Presented by: Melika Roshandell, Yun Dai, and Brad Griffin, Cadence

Abstract:
Power integrity (PI) is becoming more and more intertwined with thermal, driving the need for designers to up-level their PI signoff methodology with thermal-aware capabilities. This webinar will present new thermal-aware capabilities for PI within Cadence® Sigrity™ and Celsius™ technologies that enable transient thermal analysis along with the ability to add an enclosure to the design to see the 3D thermal impact and how an optional computational fluid dynamics (CFD) engine enables designers to see the impact from air flow.

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