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Menlo Micro welcomed Under Secretary of Defense for Research and Engineering Heidi Shyu to Menlo Micro’s headquarters to discuss the widespread applications of its technology and the company’s continued work with the Department of Defense (DOD).
As insatiable data needs continue to grow due to artificial intelligence demands, the adoption of PAM4 standard has paved the way for future PAM-level encoding schemes to address future bandwidth limitations, prolonging the life of copper interconnect.
Eric Bogatin shares a selection of free resources with high-value content to related to SI/PI/EMI. Check out these resources to learn new engineering principles, migrate to new fields, and keep up with the latest technology solutions and best design practices.
In this article, Steve Sandler presents several methods of measuring battery impedance, discussing the reasons for conducting such measurements and the challenges one might encounter along the way.
Available now in production quantities, Samtec AcceleRate Slim Direct-Attach Cable Assemblies target high-density applications in computing, datacom, AI, and shielded Gigabit Ethernet designs.
Cadence has achieved a significant milestone by designing and taping out its first-ever system chiplet, marking a groundbreaking advancement in chiplet realization capabilities.
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