Signal Integrity

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With summer upon us, it’s time to catch up on the webinars we might have missed in the last year. Here is a viewing list of the high value video content I will be reviewing in this column over the summer.

In preparation for 224 Gb/s and beyond, Samtec engaged in a research project to characterize the transmission performance of emerging PCB material sets. Brandon Gore explores the current state of the art for PCBs and cables, comparing them and assessing the technology gap to fully support the insertion loss performance required for higher data rates.

In this article, Kella Knack outlines the stackup process, highlighting the importance of taking material issues, structural issues, and performance factors into account from the beginning of the design process. Knack discusses how providing fabricators with proper design documentation that includes precise information enables them to build to specification, ensuring correct functionality while avoiding additional costs for design.

Abracon expands its line of high-performance ClearClock™ oscillators with the addition of the brand new AK2A and AK3A-series oscillators.

To provide BEV and HEV designers with a faster, more reliable high-voltage circuit protection solution, Microchip Technology has announced the E-Fuse Demonstrator Board, enabled by SiC technology, available in six variants.

By augmenting its cascode offering with seven new e-mode devices, Nexperia now provides designers with the optimum choice of GaN FETs from a single supplier alongside its substantial portfolio of silicon-based power electronics components.

Reduction of microstrip FEXT plays an important role in microwave engineering, as microstrip coupled line backward couplers suffer from poor directivity when not compensated. In this article, Henning Mextorf presents a general approach to improve directivity which does not require a modification of the dimensions of the coupled line structure and provides closed form solutions for optimum capacitor values.

In this article covering next-generation USB technology, Keysight reviews IP/PHY development kits, simulation solutions, and T&M solutions that serve as the foundation for silicon and system integrators to design compliant USB4 Version 2.0 products that meet strict interoperability requirements in the vast Type-C ecosystem.

PCB connector suppliers are often tasked with providing connectors that meet today’s high-speed and high-density requirements. In many cases, these connectors also need to maintain signal integrity under harsh conditions. Such models make it possible to simulate how the connector will interface and perform in its surrounding environment. IEH has partnered with Modelithics to offer 3D geometry models for various IEH hyperboloid connector products.