Technical Articles

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In this article, Bert Simonovich explores how to avoid “garbage in, garbage out” with field solvers by building an understanding of the nuances of PCB fabrication processes, the interpretation manufacturers’ data sheets, and the tool’s user interface.

In this article, Donald Telian supplies a reference point for making the task of implementing via impedances, thus removing via impedance discontinuities, less daunting. Read on to find out how he can help.

In part three of the Ultra-Fine Line Design Guide series, previously introduced methodology is used to explore the design space for a differential pair when the return plane is far enough away that coupling to it is negligible. Read on. 

This article presents case studies where troubleshooting tools such as RF current probes and resistive probes proved effective in troubleshooting low-frequency conducted emissions. Read on. 

This article by Donald Telian applies Eric Bogatin’s 0.3/Gbps rule of thumb to identify and prevent signal degradation due to stubs.

It’s all about the data. Loads and loads of data. How do you build a system to handle it? This article looks at interconnect options for the new PCI Express 6.0 specification: which interconnect system to choose, how to maintain signal integrity, and how to address design challenges.