Eric Bogatin, Signal Integrity Journal Technical Editor

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SIJ technical editor Eric Bogatin notes that there are some problems that occur over and over again across product families and applications. They have a handful of essential principles at their underlying root cause. In this blog, he explains that if we really understand these underlying principles, the root cause of the problems will be more apparent and their solutions closer to implement.

With more than three times more webinars offered in our Covid-19 era, we have more opportunities to accelerate up the learning curve or waste a lot of time. I sacrificed hours of my time watching dozens of webinars to identify these three princes. Check them out. They are well worth your time.

SIJ technical editor, Eric Bogatin, shares his picks for great watches or reads for this month.

The principles underlying SI, PI, and EMC are not magic, and they are not about mysterious energy flows in the space between conductors. They are firmly rooted in the fundamental properties of electromagnetic fields, with a 160 year long rich history. Embrace it!

The Ig Noble Prizes are awarded every year for an individual or group who “did something that makes people laugh and then think.” In our time of increased stress what a perfect combination of activities for engineers to participate and experience: laughing and thinking.

SIJ technical editor, Eric Bogatin, has spent many hours lately watching online training and webinars. He’s launching a regular column to share the ones he thinks are particularly worth watching. Here are his first two picks.

When you need a specialized expert or an assistant for overflow engineering design or analysis work, it’s always a challenge finding a qualified consultant. I get asked for a recommendation for a consultant at least once a week. I tell them to check out the List of SI PI and EMI Consultants on the SI Journal web site, recently updated.

Do students really understand transmission lines? Do YOU really understand transmission lines? Here is a problem I may give my students, if I am feeling particularly cruel

Here’s the dilemma every hardware engineer faces at one time or another. Your new circuit board just came back from the assembly shop, you turn it on, and it doesn’t work. You have to debug it to find the root cause of the bug(s). How are you going to do this? Turns out, there’s an app for that. Eric Bogatin explains.

Copper loss is one ingredient in interconnect loss. Surface texture or roughness has long been recognized as adding an excess loss over smooth copper. With the SI-VSP (very smooth profile) copper foils recently introduced by Mitsui Mining&Smelting Co. Ltd. (Mitsui Kinzoku), we may have reached the limits.