We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Cookie Policy.
Exceeding the speed limit is the theme of this issue of Signal Integrity Journal (SIJ), and nowhere is speed more of a design concern than for connectors. As connectors get smaller and denser while handling faster speeds, there is a significant chance that signal interference and crosstalk will increase. The following is a compilation of everyone’s thoughts on what’s new, what’s real, and what we should be worried about.
SIJ recently caught up with Timothy Vang, vice president of marketing and applications for Semtech’s Signal Integrity Products Group about the company’s latest product for 50Gbps PAM4 5G front haul deployments, how signal integrity and RF/wireless design overlap, and what is next for the team at Semtech.
It has been a year and a half since we last met in person for DesignCon 2020, and the event organizers are aiming to make the in-person experience of DesignCon 2021 in California compelling and educational. Here’s a look at what to expect.
While many already had home lab setups for projects and exploring curiosities, the challenges of the global pandemic have driven many to ramp up their set ups and spend more time at their in-house benches. Over the years, Signal Integrity Journal has worked with many leading industry experts and stars in our field. Some have gamely agreed to play along with me and share images of their home labs. Enjoy the tour!
Recently, Ansys released its HFSS Mesh Fusion product for simulation of complex EM systems. Signal Integrity Journal (SIJ) followed up with Dr. Matthew Commens, Principal Product Manager, HF at Ansys, Inc., to find out some more details.
Recently, Cadence released its Clarity 3D Transient Solver for EMI simulation. I caught up with Brad Griffin, product management group director for multi-physics system analysis in the Custom IC & PCB Group at Cadence to follow up for some more details.
Automotive design has captured the public’s imagination, and their expectations are creating countless technical challenges for engineers working in this space. For SI/PI/EMC/EMI engineers, the challenges are unique inside the car due to harsh environments as well as crowded systems.
As rated by reader views, here are the Top 10 Articles on Signal Integrity Journal for 2019. Thank you for your readership in 2019, and we look forward to bringing you many more great technical features in 2020!